Title:
METHOD FOR RECOVERING RECYCLABLE MATERIAL FROM PRINTED BOARD
Document Type and Number:
Japanese Patent JP2713231
Kind Code:
B2
Abstract:
PURPOSE: To improve recovery efficiency by a method in which electronic parts are disassembled from a printed board to be recovered as recyclable materials, the surface of the residual printed board is ground to recover solder, and the printed board is crushed to be separated into copper, resin, etc., for recovery.
CONSTITUTION: In order to recover recyclable materials from a printed board mounted with electronic parts, the electronic parts are disassembled from the board in a part disassembling process, the surface of the board is ground in the next surface grinding process, the board the surface of which is ground is crushed in a crushing process, and finally the crushed material is separated into a part containing copper largely and a part comprising a resin, a filler, etc. The material 4 to be crushed, after being crushed by a groove part 10 on a crushing table 12 and a crushing roller, is discharged to the periphery of the table 12. The crushed material entrained by an air current ascending from the periphery of the table 12 is classified by a classifier in the upper part to be taken out with the current. Besides, the crushed material is returned to the table 12 to be crushed repeatedly with the material 4 to be crushed.
Inventors:
Sadahiko Yokoyama
New year
New year
Application Number:
JP12149595A
Publication Date:
February 16, 1998
Filing Date:
May 19, 1995
Export Citation:
Assignee:
NEC
International Classes:
B09B3/00; B23K1/018; C22B7/00; B09B5/00; B02C15/00; H05K3/22; (IPC1-7): B09B5/00; B09B5/00; B23K1/018; C22B7/00
Domestic Patent References:
| JP5613050A | ||||
| JP461191A | ||||
| JP61244452A |
Attorney, Agent or Firm:
Sugano Naka
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