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Patent Searching and Data


Title:
METHOD FOR RECOVERING RESIN GRANULAR MATTER AND RESIN GRANULAR MATTER
Document Type and Number:
Japanese Patent JP2002028927
Kind Code:
A
Abstract:

To provide a method for recovering resin granular matter capable of peeling a metal film from not only a conventional metal film-applied resin material using ABS or the like as a base material but also a metal film-applied resin material using polypropylene having high adhesion as a base material.

The method for recovering the resin granular matter C includes a grinding and separating process using a grinder 20, which has a fixed blade and a rotary blade and grinds the metal film-applied resin material A by the shearing force due to both blades, to perform grinding and the separation of the metal film D and the resin granular matter C.


Inventors:
Oyama, Shigeru
Application Number:
JP2000000212975
Publication Date:
January 29, 2002
Filing Date:
July 13, 2000
Export Citation:
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Assignee:
IDEMITSU TECHNOFINE CO LTD
International Classes:
B07B4/00; B02C18/22; B03C1/00; B03C7/02; B07B9/00; B07B15/00; B29B17/02; B29B17/04; B07B4/00; B02C18/06; B03C1/00; B03C7/00; B07B9/00; B07B15/00; B29B17/02; B29B17/04; (IPC1-7): B29B17/02; B02C18/22; B03C1/00; B03C7/02; B07B4/00; B07B9/00; B07B15/00