Title:
METHOD FOR RELEASING GOLD OR PLATINUM-GROUP COATING METALLIC SUBSTRATE AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2630702
Kind Code:
B2
Abstract:
PURPOSE: To efficiently release a gold or platinum-group metal coating film without damaging a metallic substrate by anodization with its substrate coated with gold or platinum-group metal as the anode and a fluoride soln. as the electrolyte.
CONSTITUTION: Anodization is carried out with a metallic substrate coated with gold or platinum-group metal as the anode and a fluoride soln. as the electrolyte. In this case, the concn. of the soln. is preferably controlled to 5-10mol% and the bath voltage to about 7-20V. Consequently, the electrolyte is infiltrated onto the substrate through the defective and consumed parts of the coating film and electrolyzed, and the coating film is delaminated by the oxygen generated at the interface. This releasing device 5 is constituted, for example, by forming the inner wall of the vessel main body 8 contg. an electrolyte 4 with a fluoride-resistant layer of PE, PP, PVC, 'Teflon(R)', etc., using stainless steel, graphite, Ti, Ta, etc., for the cathode 3 and connecting the cathode with the anode 2 through a power source 6.
Inventors:
SHIMAMURA KYOTAKA
ABE YOSHIHIKO
SUGIMOTO HIROSHI
ABE YOSHIHIKO
SUGIMOTO HIROSHI
Application Number:
JP34550691A
Publication Date:
July 16, 1997
Filing Date:
December 26, 1991
Export Citation:
Assignee:
SATSUHORO EREKUTORO PUREITEINGU KOGYO KK
HOTSUKAIDO
HOTSUKAIDO
International Classes:
C25C1/00; C25C1/20; C25F5/00; (IPC1-7): C25F5/00; C25C1/00; C25C1/20
Domestic Patent References:
JP2310400A |
Attorney, Agent or Firm:
Takehiko Suzue
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