Title:
METHOD OF RELEASING STRAIN OF MOLDED-IN INSERT PARTICLE AND ITS DEVICE
Document Type and Number:
Japanese Patent JPS5441974
Kind Code:
A
Abstract:
PURPOSE: To release a residual stress quickly and completely, by heating rapidly only a resin part holding an insert in a molded-in insert article above the softening point of the resin.
CONSTITUTION: The resin part 2 which holds the insert member 1 in the molded-in insert article 10 molded by infection molding is heated above the softening point of the resin, by bringing it into contact with the heating plate 3 having the heater 4 or by blowing hot air on it, thus releasing a residual strain in the resin part 2.
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Inventors:
INAGE HISAO
ISHIKAWA FUMIO
UCHIDA KINYA
ISHIKAWA FUMIO
UCHIDA KINYA
Application Number:
JP10779477A
Publication Date:
April 03, 1979
Filing Date:
September 09, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B29C71/00; B29C33/00; B29C43/00; B29C43/02; B29C45/00; B29C61/00; B29D25/00; (IPC1-7): B29D3/00; B29D25/00