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Title:
METHOD FOR REMOVING DECORATED PART FROM DECORATED RESIN PLATE MOLDED PIECE AND METHOD FOR RECYCLING DECORATED RESIN PLATE MOLDED PIECE
Document Type and Number:
Japanese Patent JPH0691652
Kind Code:
A
Abstract:

PURPOSE: To peel and remove decorated parts of a decorated resin plate molded piece efficiently and make it possible to recycle the resin molded piece whose decorated parts are removed, by peeling and removing the decorated parts on the surface of the molded piece from the decorated resin plate molded piece under a predetermined condition with a prescribed abrasive and sandblast.

CONSTITUTION: In a method for removing decorated parts from a decorated resin plate molded piece, the decorated parts of the molded piece are peeled and removed under a condition of processing pressure of 2-20kg/cm2 by using abrasive of #10-#100 and gravity type or straight hydraulic type sandblast. For the resin material constituting the resin molded piece, there is no specific limitation, and there is no specific limitation in coating, deposition and plating to be used for decorations, as well. The coating, deposition, and plating which are already used for laser disk and compact disk can be used as well as the resin. For the abrasive, known materials such as resin particle, walnut particle, inorganic particle, and metallic particle can be used.


Inventors:
SATO ICHIRO
MIYASAKA YOSHIO
AOKI HIROMITSU
Application Number:
JP27098692A
Publication Date:
April 05, 1994
Filing Date:
September 14, 1992
Export Citation:
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Assignee:
SUMITOMO DOW LTD
FUJI KIHAN KK
International Classes:
B24C1/00; B29B17/00; G11B7/26; (IPC1-7): B29B17/00; B24C1/00



 
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