To provide a method for removing the end edge of a substrate film which is capable of preventing the generation of particles from the film by suppressing the build-up of the removing end portion of the interlayer insulating film of an org. resin system formed on the surface of a substrate at the time when the unnecessary portion of the film formed on the surface of the substrate is dissolved away.

In this method, the end edge removal of the substrate film to remove the end edge surface of by supplying a processing liquid to the film on the end edge surface of the substrate W of the interlayer insulating film of the org. resin system formed on the substrate of the substrate W is executed. In such a case, a soln. contg. o-dichlorobenzene is used as the processing liquid described above. The processing liquid supplied from a needle-like nozzle 7 has adequate penetrating force to the film described above and, therefore, the build-up of the removing end may be suppressed as well.