Title:
METHOD FOR REMOVING FLAW OF COMPRESSION MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2954927
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for avoiding flaw of an enclosure compression molded without using foaming agent or without temperature control of resin.
SOLUTION: In a method for compression molding an enclosure a base wall and a skirt of a periphery including female threads, thermoplastic resin is mixed with metal particles, and the particles are added in an elliptical or spherical form. The particles are given into enclosure resin carrier, and the carrier is then mixed together with resin. Melted mixed material is extruded from a nozzle, and cut into individual pellets. The respective pellets are cast in a cavity of a mold, the cavity is then closed, and the enclosure is compression molded.
Inventors:
MAAKU RONARUDO HOTSUKU
Application Number:
JP14823198A
Publication Date:
September 27, 1999
Filing Date:
April 21, 1998
Export Citation:
Assignee:
OOENSU IRINOIZU KUROOJAA INC
International Classes:
B29C43/34; B29B9/06; B29C43/00; B29C43/02; B29C70/62; B29K23/00; B29K105/16; B29K505/00; B29L1/00; B29L31/56; (IPC1-7): B29C43/02; B29C43/34
Domestic Patent References:
| JP5318511A | ||||
| JP5111965A | ||||
| JP748503A | ||||
| JP6134755A |
Attorney, Agent or Firm:
Minoru Nakamura (6 outside)