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Title:
METHOD FOR REMOVING ORGANIC MATERIAL BY FLUID LAYER FURNACE
Document Type and Number:
Japanese Patent JPH0441704
Kind Code:
A
Abstract:

PURPOSE: To quickly and cleanly thermally decompose and remove attached polymer, etc., by covering the opening of a fine hole of material to be treated with a specific filter and treating the covered opening in a fluid layer furnace in a state where the filter is situated on the lower side.

CONSTITUTION: At least either one end face in which a fine hole 3 of material to be treated, e.g. spinneret 1 is opened is shielded with a filter 2 through which a fluid medium of furnace bed is not passed, but air gas can be passed, and the filter 2 is dipped into a fluid layer in a fluid layer furnace so that the filter is situated on the lower side. Thereby a polymer, etc., attached to the fine hole 3, etc., is thermally decomposed and removed.


Inventors:
ABE HISAO
KOKUNI TAKASHI
Application Number:
JP14914390A
Publication Date:
February 12, 1992
Filing Date:
June 06, 1990
Export Citation:
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Assignee:
TORAY ENG CO LTD
International Classes:
F23G5/30; B01D41/04; B08B9/40; C23G5/00; D01D4/04; F23G5/02; (IPC1-7): D01D4/04; F23G5/02; F23G5/30



 
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