Title:
貴金属含有異種金属多層膜の除去方法及び貴金属の回収方法
Document Type and Number:
Japanese Patent JP6762867
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a removal method of an attachment of semiconductor production device parts, which can remove a multilayered film (attachment) where metal containing a plurality of kinds of precious metals attached to parts of a semiconductor production device are laminated in several tens of layers and which does not generate damage of a host material.SOLUTION: A removal method of precious metal-containing heterogeneous metal multilayered film includes a step of removing the precious metal-containing heterogeneous metal multilayered film attached to the semiconductor production device parts by wet etching, while dipping the semiconductor production device parts to which the precious metal-containing heterogeneous metal multilayered film containing a layer of a plurality of precious metals or precious metal alloys are adhered in an etching liquid that dissolves the precious metal, and also irradiating ultrasonic.SELECTED DRAWING: Figure 2
Inventors:
Shinya Taguchi
Toshiki Shirahama
Masakazu Morooka
Toshiki Shirahama
Masakazu Morooka
Application Number:
JP2016249726A
Publication Date:
September 30, 2020
Filing Date:
December 22, 2016
Export Citation:
Assignee:
Shinryo Corporation
International Classes:
C22B7/00; C22B3/04; C22B11/00
Domestic Patent References:
| JP7216530A | ||||
| JP2005191352A |
Foreign References:
| WO2013161959A1 |
Attorney, Agent or Firm:
Hisashi Kato
Takashi Kuboyama
Keita Tohsaka
Hiroshi Mori
Toru Minase
Takashi Kuboyama
Keita Tohsaka
Hiroshi Mori
Toru Minase