Title:
METHOD FOR REMOVING RESIST
Document Type and Number:
Japanese Patent JP2004029497
Kind Code:
A
Abstract:
To provide a method capable of reliably stripping and removing a resist film from the top of an article such as a semiconductor substrate using a pressure sensitive adhesive sheet.
In the method for removing a resist in which a pressure sensitive adhesive sheet is stuck on an article on which a resist film exists and the pressure sensitive adhesive sheet and the resist film are simultaneously stripped to remove the resist film on the article, the resist film is formed using a resist material containing thermally expansive microspheres in a photoresist composition and this film is heated before the stripping to expand the thermally expansive microspheres.
Inventors:
TOYODA HIDESHI
Application Number:
JP2002187243A
Publication Date:
January 29, 2004
Filing Date:
June 27, 2002
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
G03F7/004; G03F7/42; H01L21/027; (IPC1-7): G03F7/42; G03F7/004; H01L21/027
Attorney, Agent or Firm:
祢▲ぎ▼元 邦夫