PURPOSE: To remove a semiconductor small piece having thin thickness and a large area excellently from a resin sheet by moving a push-up bar in the cross direction as the end section of the semiconductor small piece is left as it is pushed up by the push-up bar and reducing the area of bonding of the resin sheet and the semiconductor small piece.

CONSTITUTION: A push-up bar 22 with a needle-like nose is lifted, the end section of a desired semiconductor small piece 21 to be removed is thrusted up up to predetermined height from a lower section through a resin sheet 20, the height of the push-up bar 22 is held, and the push-up bar 22 is shifted in the cross direction. The resin sheet 20 is peeled gradually from the back of the semiconductor small piece 21 with movement in the cross direction of the push up bar 22 at that time, thus reducing the contact area of the semiconductor small piece 21 and the resin sheet 20. Since the resin sheet 20 is peeled from the back of the semiconductor small piece 21 while the push-up bar 22 is transferred, excess stress is not applied to the semiconductor small piece 21. Accordingly, even the semiconductor small piece 21 having thin thickness and a large area is not cracked and is removed from the resin sheet, and the push-up bar 22 also does not break through the resin sheet 20.