Title:
METHOD FOR SEALING RESIN OF INTEGRATED CIRCUIT AND MASK BOARD FOR THICK-FILM PRINTING
Document Type and Number:
Japanese Patent JPH1145895
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To easily finish the thickness of a sealing resin 51 into a prescribed thickness at the time of resin sealing a fine integrated circuit. SOLUTION: In this method for resin-sealing an integrated circuit, a substrate 10 is fixed on a printing table 21, a mask board 40 is fixed to a board frame, the board frame is overlapped on a printing table 21, sealing resin 51 is allowed to run on the mask board 40, the sealing resin 51 on the mask board 40 is poured and packed in the hole of the mask board 40 by squeegees 35 and 36, and the sealing resin 51 on the substrate 10 is cured after the mask board 40 is removed. In this case, the mask board 40, in which plural small holes whose upper face opening region are smaller than the lower face opening areas are formed is fixed to the board frame, the sealing resin 51 is poured and injected into the holes by moving back and forth a squeegee head having the two squeegees, and the sealing resin 51 is applied and printed to the substrate 10.
Inventors:
TANIFUJI HIDETO
Application Number:
JP20208297A
Publication Date:
February 16, 1999
Filing Date:
July 29, 1997
Export Citation:
Assignee:
RHYTHM WATCH CO
International Classes:
B41F15/08; B41N1/24; H01L21/56; H01L23/28; H05K3/28; (IPC1-7): H01L21/56; B41N1/24; H01L23/28; H05K3/28
Attorney, Agent or Firm:
Hiromichi Kuroda (2 outside)