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Title:
METHOD FOR SEPARATING CONSTITUENT OF MULTILAYER MATERIAL
Document Type and Number:
Japanese Patent JP11090935
Kind Code:
A
Abstract:

To provide a simple method for rapidly, efficiently separating constituting materials of a multilayer material without needing use of a large quantity of solvent.

The method for separating constituting materials of a multilayer material containing plastic (B) layers isolated via layer of at least one layer of base material plastic (A) and adhesive plastic (C), comprises the steps of heating the material to temperature T1 between crystallizing temperature (Tc) of the plastic (B) and Tc-20°C, thereafter cutting the material substantially at the same temperature by shearing, interlayer separating it to alter the material into fine pieces of small size of two molds, part (X) made of substantially base material plastic (A), substantially plastic (B) and the other (Y) made of adhesive plastic (C), and then separating the pieces X and Y by electrostatic separation.


Inventors:
Berunaaru, Buandanando
Jiyan, Marii Ierunoo
Application Number:
JP1998000195491
Publication Date:
April 06, 1999
Filing Date:
July 10, 1998
Export Citation:
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Assignee:
SOLVAY & CIE
International Classes:
B03C7/02; B29B13/02; B29B17/00; B29B17/02; B29B17/04; B32B27/28; B32B27/32; B32B37/00; C08L23/02; C09J123/08; C08L23/04; C08L23/10; C08L29/04; C08L77/00; (IPC1-7): B29B17/00; B03C7/02; B29B13/02; B32B27/28; B32B27/32; B32B31/18