Title:
METHOD FOR SEPARATING LEAD FROM COPPER ALLOY
Document Type and Number:
Japanese Patent JP2005350753
Kind Code:
A
Abstract:
To provide a method for separating lead from a copper alloy by which the lead can be efficiently separated from the copper alloy.
The copper alloy is melted after the addition of Sn, Zn and Si and the resultant molten copper alloy is solidified, or, the copper alloy is melted after the addition of at least either of Sn and Zn and Si and the resultant molten copper alloy is cooled at a rate of 0.1 to 500°C/min from a temperature where it is in a molten state down to a temperature where it becomes 700°C.
Inventors:
KOBAYASHI TAKESHI
MARUYAMA TORU
MARUYAMA TORU
Application Number:
JP2004175160A
Publication Date:
December 22, 2005
Filing Date:
June 14, 2004
Export Citation:
Assignee:
UNIV KANSAI
International Classes:
C22B15/14; C22B1/00; C22B7/00; C22B9/02; C22B13/00; C22C9/02; C22C9/04; C22C9/08; C22C9/10; (IPC1-7): C22B15/14; C22B1/00; C22B7/00; C22B9/02; C22B13/00
Attorney, Agent or Firm:
Noboru Fujimoto
Seiichi Yakumaru
Hiroaki Nakatani
Tokuya Iwata
Seiichi Yakumaru
Hiroaki Nakatani
Tokuya Iwata