To develop a method wherein a cost merit is obtained by higher productivity per working machine, regarding a semiconductor wafer having regulated quality.
In the state that a semiconductor wafer is positioned in a carrier 1 which is rotated by an outside ring 6 having drive pins and an inside ring 5 having drive pins, the semiconductor wafer is moved in a part between two grinding surface plates 7 which are rotated reversely to each other by using movement forms which can be drawn by a prescribed orbit curve which is relative to an upper side working surface plate and a prescribed orbit curve which is relative to a lower side working surface plate. In this case, both of the orbit curves have external appearances which are still opened after six loops around a central point are formed and have a curvature radius of at least the same size as a radius of the inside drive ring, at each part.
| JP2016060014 | GRINDER, GRINDING METHOD, AND PROGRAM |
| JPH0632895 | [Title of Invention] Grindstone Diameter Correction Method |
| JP2019171509 | SURFACE FINISH METHOD FOR METAL MOLD |
THOMAS ALTMANN
HEIER GERHARD
WOLFGANG WINKLER
KANN GUNTHER
