Title:
METHOD FOR SOLDERING CHIP PARTS
Document Type and Number:
Japanese Patent JPH05212580
Kind Code:
A
Abstract:
PURPOSE: To prevent chip rising of chip parts by using solder paste consisting of a powder solder alloy having a compsn. with which the heat absorption peak in a differential thermal analysis appears at the beginning of melting and even after the melting.
CONSTITUTION: The soldering of the microchip parts to a printed board is executed by using the solder paste obtd. by pulverizing the solder alloy which has ≤230°C liquidus line and with which the heat absorption peak in the differential thermal analysis appears at the beginning of melting and again appears at the time of melting of the greater part and mutually mixing this powder and a liquid or pasty flux. The chip rising is thereby prevented.
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Inventors:
KATO RIKIYA
Application Number:
JP5606592A
Publication Date:
August 24, 1993
Filing Date:
February 07, 1992
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/22; H05K3/34; (IPC1-7): B23K35/22; H05K3/34
Domestic Patent References:
| JPS5690948A | 1981-07-23 | |||
| JPS5145648A | 1976-04-19 | |||
| JP40025885A | ||||
| JPS5117951A | 1976-02-13 | |||
| JPS5744440A | 1982-03-12 |