PURPOSE: To facilitate soldering a plurality of electronic components on a printed board simultaneously by a method wherein a heat-resistant sheet member is bonded to the region of the surface of the printed board including through-holes and the tips of the lead terminals of the electronic component are inserted into the through- holes piercing through the heat-resistant sheet member and the protruding parts of the lead terminals on the rear of the board are connected to wiring patterns with solder.
CONSTITUTION: A semi-transparent heat-resistant, for instance, silicon system, sheet member 12 is bonded to the region of the surface of a printed board 11 which has predetermined wiring patterns on its rear. The tips of the lead terminals of electronic components 13 which are covered with resin or the like so as to be free from penetration of flux are inserted into through-holes at the predetermined positions of the printed board 11. The lead terminals of an electronic component 14 are inserted into through-holes in the part where the heat-resistant sheet member 12 is bonded piercing through the heat-resistant sheet member 12 and made to protrude from th rear of the printed board. Flux is applied to the protruding parts of the lead terminals on the rear of the printed board 11 and melted solder is applied to the protruding parts to solder the protruding parts to the wiring patterns.
Nagase, Minoru
Yamanaka, Yoshinobu
