PURPOSE: To reduce assembly processes of additional soldering and prevent solder bridges by a method wherein a gap is formed between a section excluding terminals of parts and a printed wiring board via a gap forming material containing materials difficult to solder and a printed wiring board of parts is soldered and the gap is bathed in solder to the base of a terminal.
CONSTITUTION: Before mounting parts to a printed wiring board, a gap forming material containing materials difficult to solder is interposed between the section excluding the terminals of parts and the printed wiring board and a gap is formed. That is, the terminals 6 and 7 of parts 4 are inserted to the through hole 8 and the non-through hole 9 of a printed wiring board 1 respectively, and the tape 11 is put between the printed wiring board 1 and the parts 4. A gap 12 is formed between the bottom surface of the metal case 5 of the parts 4 and the printed wiring board 1. Therefore, if the printed wiring board 1 is immersed in a solder bath in a state in which the parts 4 is mounted to the printed wiring board 1, a solder 10 penetrates into the through hole 8 and the air inside the through hole 8 passes through the gap 12 and escapes to the outside. This makes it possible to obviate an assembly process of additional soldering.
| JP3950499 | INERT ATMOSPHERE SOLDERING DEVICE |
HAMADA TAKUMA
SHIBATA JUNICHI
TAKADA KIYOSHI
