Title:
METHOD FOR SPRAY CLEANING
Document Type and Number:
Japanese Patent JPS59184530
Kind Code:
A
Abstract:
PURPOSE:To obtain the pure wafer or mask with a clean pattern by using both of pure water by spray and that by running water. CONSTITUTION:A rotating sample 1 is subjected to the pure water 3 injected from a spray nozzle 2 and the pure water 5 flowing out from a nozzle 4 for running water. Consequently, a water film of a constant thickness is maintained on a surface of the rotating sample 1 by the pure water 5 flowing out from the nozzle 4 for running water, thereby reducing the impact force of spray by the pure water 3 injected from the spray nozzle 2 applied to a surface of the sample 1. Also, as the water film becomes more thick by the running water, the resist already processed and the dust are included in the water film and are removed from the sample 1 by the centrifugal force produced the rotation. Accordingly, the pure sample 1 with a clean pattern can be obtained.
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Inventors:
WATANABE AKIRA
Application Number:
JP5800283A
Publication Date:
October 19, 1984
Filing Date:
April 04, 1983
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
B08B3/02; H01L21/304; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Shinnosuke Tsunoda
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