Title:
METHOD FOR STICKING FILM TO LEAD FRAME
Document Type and Number:
Japanese Patent JP3028997
Kind Code:
B2
Abstract:
PURPOSE: To improve the accuracy of the sticking position of a film without cumbersome working by positioning the adhesive film so that a lead frame has a minute distance, which prevents the deviation of the adhesive film, to a die when the adhesive film is stuck to the lead frame.
CONSTITUTION: A heater block 5 is lifted with an actuator 9. Thus, a lead frame 6 is lifted up. A lead frame 6 is arranged so as to have a distance C downward from a die 2. When a punch 1 is lowered, the punch cuts a film 7 into a specified shape in cooperation with the die 2. Thereafter, the punched film 2 and the lead frame 6 which is arranged at the distance C at the lower side of the die 2 are pushed to the heater block 5, which is lifted with the actuator 9 and held. The film is stuck to the specified position of the lead frame 6 by thercompressing bonding. Thus, the accuracy of the sticking position of the film 7 to the lead frame 6 can be enhanced.
Inventors:
Toshio Kawamura
Kenichi Kaneko
Noboru Imai
Satoshi Sasaki
Hiroyuki Kousaka
Kenichi Kaneko
Noboru Imai
Satoshi Sasaki
Hiroyuki Kousaka
Application Number:
JP16600093A
Publication Date:
April 04, 2000
Filing Date:
June 11, 1993
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
C09J5/00; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP4196576A |
Attorney, Agent or Firm:
Tadao Hirata (1 outside)