PURPOSE: To obviate the damage of a circuit board in stripping of thin light transmissive films on photosensitive resin layers by providing thin film stripping guide members to the titled device, and sticking the thin films to the guide members to strip the films, then detaching the guide members from the circuit board.

CONSTITUTION: The printed circuit board is formed by laminating the thin light transmissive films on the photosensitive resin layers. Such circuit board is conveyed by control rollers 3 along a conveyance line AA of a thin film stripper. Needle-like projecting members are provided projecting and pressing mechanism 4. Spaces are formed between the thin light transmissive films and the photosensitive resin layers by the projecting members. Fluid is blown to the spaces from fluid blowing mechanisms 5 to strip the thin light transmissive films. The stripped light transmissive films are stuck to the thin film stripping guide members 6B and are pinched between conveyor belts 6A and 6B, by which the thin films are successively stripped. The guide members 6B are then detached from the circuit board. The thin film stripping guide members are brought near to the circuit board to surely strip the thin films and are then detached therefrom in the above-mentioned manner and therefore, the damage of the photosensitive resin layer is prevented.