Title:
METHOD AND STRUCTURE OF ATTACHING MOUNTING PLATE TO ELECTRONIC PART MAIN BODY
Document Type and Number:
Japanese Patent JP3637285
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting plate cuttaching method and a structure capable of improving electronic parts in assembly accuracy and efficiency and reducing the cost of production facilities.
SOLUTION: A first process of continuously punching sliders (mounting plate) 20 which are connected to a thin plate 10 with connectors 41 and 41 out of the thin plate 10 by making the thin plate 10 undergo press working successively, a second process of fixing a rotary object (electronic part main body) 50 to each of the sliders 20 connected to the thin plate 10, and a third process of taking out the unit rotary objects 50 mounted on the sliders 20 by cutting the connectors 41 and 41 of the sliders 20 mounted with the rotary object 50 are provided.
Inventors:
Shigemasa Takahashi
Mitsuru Hosokawa
Nobuyuki Yagi
Kozo Morita
Mitsuru Hosokawa
Nobuyuki Yagi
Kozo Morita
Application Number:
JP2001067134A
Publication Date:
April 13, 2005
Filing Date:
March 09, 2001
Export Citation:
Assignee:
Teikoku Communication Industry Co., Ltd.
International Classes:
H01C10/14; H01C10/00; H01C10/32; H05K13/00; (IPC1-7): H01C10/14
Domestic Patent References:
| JP10261509A | ||||
| JP59138209U | ||||
| JP4122002A |
Attorney, Agent or Firm:
Takashi Kumagai
Yu Takagi
Yu Takagi