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Patent Searching and Data


Title:
METHOD AND STRUCTURE FOR FORMING HEAT SENSOR
Document Type and Number:
Japanese Patent JPH08233660
Kind Code:
A
Abstract:

To provide method and structure for forming an array of heat-sensitive elements from a substrate of heat-sensitive material fixed with an infrared ray absorbing body and the various parts of a common electrode assembly.

An array of heat-sensitive element is formed of a pyroelectric substrate 46 fixed with an infrared ray absorbing body and a common electrode assembly 18. A first conductive contact layer 60 is formed to partially define a marked region 61 and an unmasked region 68 of the substrate 46. A second conductive contact layer 62 is formed on the first conductive contact layer 60. A mask layer 66 is formed to capsule the exposed part of second contact layer 62. Since the unmasked region 68 is exposed to etching liquid 70 and irradiated with radiation in order to substantially accelerate reaction between them, the unmasked region 68 is removed at a substantially higher rate than the first conductive contact layer 60 and mask layer 66 by the etching liquid during irradiation.


Inventors:
JIEEMUSU EFU BERUCHIYAA
HAWAADO AARU BERATAN
SUKOTSUTO AARU SAMAAFUERUTO
Application Number:
JP11096A
Publication Date:
September 13, 1996
Filing Date:
January 04, 1996
Export Citation:
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Assignee:
TEXAS INSTRUMENTS INC
International Classes:
G01J1/02; G01J5/02; G01J5/34; H01L37/02; (IPC1-7): G01J5/02; G01J1/02
Attorney, Agent or Firm:
Akira Asamura (3 outside)