Title:
METHOD AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE, ELECTROOPTIC DEVICE, METHOD OF MANUFACTURING ELECTROOPTIC DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP3722137
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a novel method of mounting semiconductor device by which the reliability of conductive joints can be improved even when the numbers of wiring terminals and electrodes increase and the intervals among them become narrower, and to provide a structure for mounting the semiconductor device, an electrooptic device, and electronic equipment.
SOLUTION: Wiring terminals are formed on a wiring board and electrodes are formed in a semiconductor device. The wiring terminals are formed so that their widths may become narrower than those of the electrodes. When the semiconductor device is mounted on the wiring board, the wiring terminals bite into the electrodes due to applied pressurizing forces. It is preferable to adjust the biting amounts of the wiring terminals into the electrodes within the range of from about 1 μm to 5 μm.
Inventors:
Kazuyuki Yamada
Takeshi Ashida
Masahiko Nakazawa
Yumoto Masanori
Takeshi Ashida
Masahiko Nakazawa
Yumoto Masanori
Application Number:
JP2003197276A
Publication Date:
November 30, 2005
Filing Date:
July 15, 2003
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G02F1/13; G02F1/1362; G09F9/00; H01L21/60; G02F1/1345; H01L21/603; H01L23/00; H01L23/485; H01L23/498; H05K3/32; (IPC1-7): H01L21/60; G02F1/1345; G02F1/1362; G09F9/00
Domestic Patent References:
| JP2001223243A | ||||
| JP1171454U | ||||
| JP11251363A | ||||
| JP8031864A |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa
Fujitsuna Hideyoshi
Osamu Suzawa