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Title:
METHOD OF SUPPLYING SOLID ORGANOMETALLIC COMPOUND
Document Type and Number:
Japanese Patent JP2008111147
Kind Code:
A
Abstract:

To provide a method of supplying a solid organometallic compound, by which the organometallic compound which is solid at normal temperature can be supplied at a constant concentration, and the usage rate of the solid organometallic compound placed in a container can be improved.

In the method of supplying the solid organometallic compound, which method comprises placing the solid organometallic compound in a container, introducing a carrier gas into the container, and supplying the solid organometallic compound by taking a gas containing the organometallic compound out of the container, the solid organometallic compound is placed in the container in the form of pellets 5 containing an inert support. The pellets are previously molded by placing the inert support and the solid organometallic compound in a plurality of pellet-shaped recessed portions provided on a molding plate, then hot-melting the compound, and thereafter solidifying by cooling.


Inventors:
INUI KATSUMI
IDE NAOYUKI
TAKAHASHI MOTOI
Application Number:
JP2006000293711
Publication Date:
May 15, 2008
Filing Date:
October 30, 2006
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C23C16/448; H01L21/205; C07F5/00
Domestic Patent References:
JP2003249359A2003-09-05
JP2004273456A2004-09-30
JPH01265511A1989-10-23
JP2005033146A2005-02-03
JP2007277703A2007-10-25
Attorney, Agent or Firm:
中山 亨
榎本 雅之