To provide a method of supplying a solid organometallic compound, by which the organometallic compound which is solid at normal temperature can be supplied at a constant concentration, and the usage rate of the solid organometallic compound placed in a container can be improved.
In the method of supplying the solid organometallic compound, which method comprises placing the solid organometallic compound in a container, introducing a carrier gas into the container, and supplying the solid organometallic compound by taking a gas containing the organometallic compound out of the container, the solid organometallic compound is placed in the container in the form of pellets 5 containing an inert support. The pellets are previously molded by placing the inert support and the solid organometallic compound in a plurality of pellet-shaped recessed portions provided on a molding plate, then hot-melting the compound, and thereafter solidifying by cooling.
IDE NAOYUKI
TAKAHASHI MOTOI
| JP2003249359A | 2003-09-05 | |||
| JP2004273456A | 2004-09-30 | |||
| JPH01265511A | 1989-10-23 | |||
| JP2005033146A | 2005-02-03 | |||
| JP2007277703A | 2007-10-25 |
Masayuki Enomoto