To provide a surface treatment method that leads to the manufacture of an equipment member which has more excellent corrosion resistance than a conventional one even if being used in equipment contacting with the melt of a lead-free solder and is inexpensive, and to provide a device for packaging electronic parts, which has the equipment manufactured through using the method.
The method for surface-treating the material or equipment of alloy steel such as stainless steel, which contacts with the melt of the lead-free solder containing 85% or more tin, comprises: hot-dip plating Al or an Al alloy on the surface of the material or the equipment; heating the plated article to diffuse Al or the Al alloy into the alloy steel; simultaneously melting the surplus Al or the Al alloy having deposited on the surface when plated, and removing it by free fall; and further removing flux trapped on the surface during a plating process, with an acidic solution; and forming an Fe-Al intermetallic compound layer or an aluminum-diffused layer having an Al concentration of 13 to 60 atom% on the surface. The device for packaging the electronic parts is provided with the equipment manufactured through using the method.
SHIMIZU HIDEO
TSUKIOKA YASUO
SHINWA HEAT TREAT CO LTD
SHINKO KINZOKU KOGYO KK