To provide a method for manufacturing an IC card with good appearance, while suppressing generation of bubbles.

The method for manufacturing the IC card by bonding an inlet between a pair of base materials through an adhesive includes processes of: applying the adhesive onto one face of a first base material; two-dimensionally disposing the inlet on the face of the first base material with the adhesive applied thereon; applying the adhesive on one face of a second base material, and stacking it on the first base material; pressurizing it by a roller to uniform a film thickness; and punching it in a card shape. In the process of applying the adhesive, an application nozzle to the applied face is vertically moved while relatively horizontally moving the application nozzle in a direction parallel to a column of two-dimensional arrangement of the inlet, an interval between the application nozzle and the applied face in an area between rows of the two-dimensional arrangement of the inlet is made larger than an interval between the application nozzle and the applied face of a row area, and more adhesive is applied between the rows than in the row area.