Title:
METHOD AND TOOL FOR TYING SMALL DIAMETER PACKAGE WITH RESIN BAND
Document Type and Number:
Japanese Patent JP3304659
Kind Code:
B
Abstract:
PURPOSE: To firmly hold the tip of a tie band without using a special holding device by a method wherein the tip of the tie band is partly bent, the bent part is laid on the bottom of a welding base, and the tie band that is wound once around an item to be packaged is fixed by running it over a welding- tightening base and between tight holes.
CONSTITUTION: When a rotary valve 40 of a tightening device 4 of a tying tool 1 is operated, a tie wheel 41 turns counter clockwise, and a band 3 is pulled to the right side. The band 3 is previously bent at a tip 31 to form a bent part 32, and when the band 3 is wound around the circumference of an item 2 to be tied, the bent part 32 of the band 3 is caught on the tip of a welding base 11. When the wheel 41 turns further to tighten the band 3 strongly, the bent part 32 bite into triangular teeth 23 at the tip of the welding base 11, so that the tip of the band 3 is fixed. After that, an overlapping part 30 of the band 3 undergoes vibration friction welding to form a tension-proof seam and an excessive band 35 of the band 3 that ties the item 2 is cut off by a cutter 17.
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Inventors:
Harada, Hiroshi
Application Number:
JP1994000341199
Publication Date:
May 10, 2002
Filing Date:
December 28, 1994
Export Citation:
Assignee:
KOHAN KOGYO KK
International Classes:
B65B27/10; B65B13/22; B65B13/32; B65B27/00; B65B13/18; (IPC1-7): B65B13/32; B65B13/22; B65B27/10
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