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Title:
エレクトロルミネッセンス構造体を転移させる方法
Document Type and Number:
Japanese Patent JP7241757
Kind Code:
B2
Abstract:
A method for transferring electroluminescent structures onto a face, referred to as the accommodating face, of an accommodating substrate. The accommodating face is moreover provided with interconnections intended to individually address each of the structures. The electroluminescent structures are initially formed on a supporting substrate and are separated by tracks. It is then proposed in the present invention to form reflective walls, vertically above the tracks, which comprise a supporting polymer (the second polymer) supporting a metal film on its sides. Such an arrangement of reflective walls makes it possible to reduce the stresses exerted on the electroluminescent structures during the transfer method according to the present invention. Moreover, the reflective walls, within the meaning of the present invention, may be produced on all the electroluminescent structures resting on a supporting substrate.

Inventors:
Marion Volpel
Vincent Bay
Francois Levy
Mario Ibrahim
Fabrice de Moro
Application Number:
JP2020534216A
Publication Date:
March 17, 2023
Filing Date:
December 17, 2018
Export Citation:
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Assignee:
Comissaria Allenergy Atmic Eo Zenerji Zartana Tave
Aredia
International Classes:
H01L33/62; H01L21/02; H01L33/00; H01L33/20
Domestic Patent References:
JP2005347647A
JP2016178307A
JP2015524173A
JP2015526889A
JP2008186959A
Foreign References:
US20160141469
WO2008062783A1
WO2009066430A1
US20060284190
WO2017216445A1
US20170301660
US20160270176
CN104779239A
DE102017113745A1
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe



 
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