To improve throughput or transfer accuracy by using both of a mode in which a mask stage and/or a wafer stage is moved in a step-and-repeat state and another mode in which the mask stage and or/wafer stage is moved in a continuously scanning state during pattern transfer.

In a method for transferring pattern, a mask is irradiated with a lighting beam by moving the beam while the beam is deflected in the X- direction in each scanning zone 63 at the time of transferring a chip pattern 61. The beam patterned through the mask is reduced and deflected by means of an projection optical system and forms an image on a wafer. In order to expose the next scanning zone, a mask stage and a wafer stage are synchronously and continuously moved in the Y-direction. When the adjacent stripe 62' of one stripe 62 is exposed after the stripe 62 is exposed, the mask and wafer stages are fed in the X-direction by temporarily stopping the exposure and the stripe 62' and the part of the wafer corresponding to the transfer area are positioned closely to the optical axis of the aligner.