To enable easy removal of a plate-like object from a support member to enhance productivity more than in the conventional practice when performing transfer work of removing the plate-like object from the support member to paste the plate-like object to a transferring sheet again, and to reduce the risk of damaging the plate-like object when pasting the plate-like object to the transferring sheet.

After grinding a wafer (plate-like object) 10 of a plate-like unit 1, the wafer 10 is pasted to an adhesive sheet 43 at an opening 44a part of a transferring sheet 40. After that, by using a peeling table 30B having an attraction region 39 larger than the wafer 10 and smaller than an outer circumferential size of an adhesive 16 surrounding the wafer 10, and a projection region 37 including a projection surface 38 surrounding the attraction region 39 and projecting from an attraction surface 36 of the attraction region 39, the wafer 10 together with the adhesive sheet 43 are attracted by negative pressure action to remove the wafer 10 from the support member 15 and the adhesive 16, and the wafer 10 with the transferring sheet 40 pasted thereto is obtained.