Title:
METHOD FOR TRANSLOCATING SOLDER BALL
Document Type and Number:
Japanese Patent JP3211782
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for translocating solder balls by which the solder balls are vacuum sucked surely one by one into a suction hole and then the vacuum sucked balls are surely moved to a work when the solder balls are vacuum sucked into the suction hole and moved to the work.
SOLUTION: Equipped are a positioning table A to position the work 17, a ball gathering place B to accommodate a plurality of solder balls 19, a suction head C equipped with a suction hole which vacuum sucks and picks up the solder balls 19 from the ball gathering place B and then drops off the solder balls 19 and moves them to the work 17, a transferring means D to move the suction head C between the ball gathering place B and the work 17, and further a vibrator 29 to vibrate the solder balls 19 retained in the suction head C.
Inventors:
Tadahiko Sakai
Shoji Sakemi
Shoji Sakemi
Application Number:
JP24485998A
Publication Date:
September 25, 2001
Filing Date:
August 31, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P19/00; B23K3/06; H01L21/60; H05K3/34; (IPC1-7): B23K3/06; H01L21/60; H05K3/34
Domestic Patent References:
| JP4368142A | ||||
| JP7226425A | ||||
| JP7153765A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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