Title:
METHOD FOR TREATING POLYAMIDE RESIN MOLDING BEFORE COATING
Document Type and Number:
Japanese Patent JPH04142339
Kind Code:
A
Abstract:
PURPOSE:To improve the adhesiveness and surface flatness of a coating film by dipping a polyamide resin molding in an alcohol soln. of an epoxidized silane coupling agent before coating the molding. CONSTITUTION:0.01-2.0wt.% epoxidized silane coupling agent (e.g. 3- glycidoxypropylmethoxysilane) is dissolved in an 8C or lower alcohol (e.g. isopropyl alcohol) to give a soln. A polyamide resin molding is dipped in the soln. and coated with a coating material.
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Inventors:
YAMAMIYA KAZUO
WATANABE NORIYOSHI
WATANABE NORIYOSHI
Application Number:
JP26373390A
Publication Date:
May 15, 1992
Filing Date:
October 03, 1990
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08J7/04; (IPC1-7): C08J7/04