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Title:
METHOD FOR TRIMMING RESISTOR WITH LASER
Document Type and Number:
Japanese Patent JPH09171911
Kind Code:
A
Abstract:

To avoid the reaching of the thermal effect in laser beam trimming on a part other than a trimming groove by blowing the gaseous cooling medium to the vicinity of the part among a resistor film and a protecting film, to which laser beam is projected, and projecting the laser beam under this state.

When a trimming groove 2 is cut and provided in a spiral shape by a laser beam trimming method for a cylindrical resistor 1, the cooling medium such as air, which is compressed by a compressor 8 and cooled to the temperature lower than atmospheric temperature by a cooler 9, is blown to the vicinity of a part, to which the laser beam is projected, at the outer surface of the cylindrical resistor 1 through a nozzle 10. Thus, among a resistor film and a protecting film, the vicinity of a part, to which the laser beam is projected, can be sequentially cooled, and the range affected by the thermal effect in the laser beam trimming can be made small.


Inventors:
TERAMAE TOSHIHIRO
Application Number:
JP32868795A
Publication Date:
June 30, 1997
Filing Date:
December 18, 1995
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H01C17/242; (IPC1-7): H01C17/242
Attorney, Agent or Firm:
Akio Ishii (2 outside)



 
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