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Title:
METHOD FOR WAFER PROCESSING AND WAFER PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2001053128
Kind Code:
A
Abstract:

To visually confirm the transfer position of a water from wafer support pins to a wafer transfer machine at the time of teaching, even if the wafer support pins are provided at the positions hard to visually observed.

In a wafer processing apparatus, through operation of a wafer transfer machine, a wafer is transferred between the wafer transfer machine and wafer support pins 2 for processing, which are provided at the positions hard to visually observed to allow the wafer transfer machine to learn a wafer transfer position for the wafer support pins 2 based on the transfer position. Different from the wafer support pins 2, wafer support pins for learning 27 which for supporting the wafer W are provided on the top of the apparatus which is easily observed visually. The center of the wafer at the time of placing the wafer W on the wafer support pins 27 is matched with the center of the wafer, at placing of the wafer W on the wafer support pons 2. Instead of the wafer supporting pins 2, the wafer W is transferred between the wafer support pins 27 and the wafer transfer machine. Thus, the wafer transfer machine is made to learn the wafer transfer position for the wafer support pins 2, based on the wafer transfer position.


Inventors:
OSAKA AKIHIRO
SUGAWARA MASASUE
Application Number:
JP22912399A
Publication Date:
February 23, 2001
Filing Date:
August 13, 1999
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
B23Q3/18; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B23Q3/18
Attorney, Agent or Firm:
Toru Yui (2 outside)