Title:
METHOD FOR WIRE BONDING
Document Type and Number:
Japanese Patent JPS55105337
Kind Code:
A
Abstract:
PURPOSE:To ensure confirmation of the co-ordinates, by providing an XY-movement measuring device on an XY-movement table constituting a bonding device, adding the signal therefrom to an operating device at every completion of one stroke, and comparing the signal with predetermined position information. CONSTITUTION:A bonding head 13 is mounted on an XY table 11, from which a bonding arm 12a is protruded so that it can move up and down on a support 12d. A bonding tool 12, at the end of which a wire is pierced is provided. Under the table 11, a linear encoder head 21 and a linear encoder scale 22 are provided, and the output therefrom is sent to a measuring device 23 where the local co-ordinates are obtained. Then, the co-ordinates are compared with a specified co-ordinates values in an operating device 24. Thereafter, a pulse motor 16 is operated by the output via an output device 25 for a compensating amount of movement. The table 11 is moved with the co-ordinates being confirmed by an optical sensor 18 and an original-point-confirming cam 17, thereby the position is controlled at every completion of a stroke.
Inventors:
KACHI KAZUO
Application Number:
JP1186879A
Publication Date:
August 12, 1980
Filing Date:
February 06, 1979
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
G05D3/12; H01L21/60; (IPC1-7): H01L21/60