To provide a multilayer shield substrate especially with improved smoothing property of a copper foil surface and improved adhesion property of an insulation layer resin, in a method for manufacturing a multilayer shield substrate by performing roll lamination of an adhesive resin with copper foil to an inner-layer circuit board.

A photo-curing resin ink 9 is applied to the entire surface of an inner-layer circuit board 8. Then, when an undercoat layer 13 is formed by applying ultraviolet rays 5 to the above photo-curing resin ink 9, the degree of curing of the photo-curing resin 10 on the inner-layer circuit and a photo- curing resin 11 on the inner-layer insulation board is changed selectively by applying the ultraviolet rays 5 to an inner-layer pattern positive film 12 in two steps.