Title:
METHOD FOR WORKING BRITTLE MATERIAL BY WATER JET
Document Type and Number:
Japanese Patent JP2678853
Kind Code:
B2
Abstract:
PURPOSE: To obtain a product free from a chip in the end part of a hole in the case of working a small hole in the brittle material by a water jet by projecting the water jet in the side inner than designated cutting dimension by the diameter of the jet on the whole, cutting the brittle material and thereafter projecting the water jet in the designated cutting dimension and performing final cutting.
CONSTITUTION: A hole is pierced in the inside of a cutting range of brittle material 1 and a water jet projected to a primary cutting and working position of the side inner than designated dimension by the diameter of the jet (diameter of a nozzle 2) on the whole and cuts the brittle material and is moved. When the generated broken material is separated, a chip part 5 is sometimes generated in a product side. Then when working is performed in accordance with the designated dimension, the chip part 5 is completely cut off. Further since the broken material is not generated in the final cutting work, the new chip part 5 is not generated.
Inventors:
Takanori Seinami
Toru Nomura
Toru Nomura
Application Number:
JP8276992A
Publication Date:
November 19, 1997
Filing Date:
March 04, 1992
Export Citation:
Assignee:
Shibuya Industry Co., Ltd.
International Classes:
B24C5/02; B26F3/00; B28D1/14; C03B33/00; (IPC1-7): B26F3/00; C03B33/00
Attorney, Agent or Firm:
Katsushi Nishina