Title:
浮遊式微細構造を製造するための方法および浮遊式微細構造処理アセンブリ
Document Type and Number:
Japanese Patent JP3605487
Kind Code:
B2
Abstract:
A suspended microstructure process assembly includes a first microstructure assembly, with a temporary substrate having a first surface and a first microstructure fabricated on the first surface; a second microstructure assembly, including a final substrate having a second surface and a second microstructure fabricated on the second surface; connecting elements for joining the first microstructure assembly to the second microstructure assembly with a predetermined separation and alignment; and a removable bond temporarily securing the first microstructure assembly to the second microstructure assembly until the temporary substrate is removed. The connecting elements may be electrically conductive contacts or electrically nonconductive spacers. Electrically conductive contacts may be supplied to the first microstructure from a back side of the first microstructure assembly. The first microstructure fabricated on the first surface may incorporate a removable layer to enable multiple level suspended structures.
Inventors:
William E. Tennant
Isolis S. jergis
Charles W Seaberry
Isolis S. jergis
Charles W Seaberry
Application Number:
JP30034496A
Publication Date:
December 22, 2004
Filing Date:
November 12, 1996
Export Citation:
Assignee:
DRS SENSORS & TARGETING SYSTEMS, INC.
International Classes:
G01J5/02; G01J5/20; G03F7/00; H01L21/302; G01J1/02; H01L37/02; (IPC1-7): G01J1/02; G01J5/02; H01L37/02
Domestic Patent References:
| JP5948950A | ||||
| JP5843554A | ||||
| JP264420A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai