Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
粘膜の痛みを治療するための方法および組成物
Document Type and Number:
Japanese Patent JP2004501181
Kind Code:
A
Abstract:
Compositions useful for long-lasting pain relief from mucosal damage, such as mucosal inflamation, abrasions, ulcerations, lesions, trauma and incisions, without significant systemic absorption. The compositions of the invention are particularly suitable for application to the mucous membrane of the nasal cavity and buccal cavity. To relieve pain, the compositions or the invention are topically applied directly to the affected area.

Inventors:
Williams, Robert, Oh.
Zhang, Feng
Collen, John, Jay.
Pastel Nak, Gabril, W.
Kolesnikov, Yuri, A.
Application Number:
JP2002504977A
Publication Date:
January 15, 2004
Filing Date:
June 26, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Epicept Corporation
International Classes:
A61K9/00; A61K31/167; A61K31/445; A61K31/451; A61K31/4748; A61K31/485; A61K45/06; A61K47/34; A61P1/02; A61P17/02; A61P23/02; A61P25/04; A61K9/12; A61P29/00; A61P41/00; A61P43/00; (IPC1-7): A61K45/06; A61K9/12; A61K31/167; A61K31/451; A61K31/4748; A61K47/34; A61P1/02; A61P17/02; A61P23/02; A61P29/00; A61P41/00; A61P43/00
Domestic Patent References:
JPH05201854A1993-08-10
Foreign References:
WO1998026770A21998-06-25
WO2000004878A12000-02-03
WO1997000275A21997-01-03
WO1999015210A21999-04-01
Attorney, Agent or Firm:
Yusuke Hiraki
Satoshi Fujita
Yumi Naito



 
Previous Patent: JP2004501180

Next Patent: 湿式粉砕法