Title:
材料除去を決定する方法及びワークのビーム加工装置
Document Type and Number:
Japanese Patent JP7105247
Kind Code:
B2
Abstract:
A method for determining material removal by an ion beam (3) on a test workpiece (7) which is disposed in a machining chamber (5) of a housing (6) of a device (1) for beam machining, wherein the test workpiece (7) has a substrate (8) and a layer (9) applied to the substrate. The method includes a) optically determining a layer thickness (d1) of the layer applied to the substrate, b) removing material of the layer from the test workpiece with the ion beam, c) optically determining the layer thickness (d2) of the layer applied to the substrate, and d) determining the material removal by comparing the layer thickness determined in step a) with the layer thickness determined in step c). Also disclosed is a device (1) for beam machining a workpiece (2) with which the method can be carried out.
Inventors:
Stephen Bezold
Stephan Zix
Stephan Zix
Application Number:
JP2019551941A
Publication Date:
July 22, 2022
Filing Date:
February 08, 2018
Export Citation:
Assignee:
Carl Zeiss SGM Gaehha
International Classes:
B23K15/00; B23K26/36; C03C15/00; H01L21/302
Domestic Patent References:
| JP2005301032A | ||||
| JP2005037315A |
Foreign References:
| US20170029939 | ||||
| US20130256262 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Kosuke Miyatani
Mitsutsugu Sugimura
Kosuke Miyatani
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