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Title:
接合表面を検査するための方法およびデバイス
Document Type and Number:
Japanese Patent JP7046988
Kind Code:
B2
Abstract:
A method for inspecting a joining surface (14) of a substrate, wherein a component is to be adhered to the joining surface of the substrate by means of an adhesive material (27), wherein the method comprises the following steps: •—providing at least one planar test textile (20), which has a fiber material (21) and an adhesive primer (22), •—applying the planar test textile to at least one part of the joining surface of the substrate to which the component is to be adhered so that the adhesive primer of the planar test textile contacts the joining surface of the substrate, •—at least partially curing the adhesive primer of the planar test textile in order to integrally bond the planar test textile to the substrate by means of the adhesive primer, •—pulling off the planar test textile after at least partially curing the adhesive primer and inspecting the joining surface by means of a qualitative evaluation of the fracture pattern between the cured adhesive primer and the planar test textile and/or by means of a quantitative evaluation of the pull-off force determined when pulling off the planar test textile.

Inventors:
Heilmann, Rennelt
Application Number:
JP2019570088A
Publication Date:
April 04, 2022
Filing Date:
May 11, 2018
Export Citation:
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Assignee:
Deutsch Zentrum Fur Luft-Und Raumfert A. Fau
International Classes:
B29C65/82; B29C65/48; G01N19/04
Domestic Patent References:
JP2008024357A
JP2010013567A
JP2017052127A
JP2007118491A
JP2017066237A
JP2009208231A
JP2016106168A
JP2016109561A
Foreign References:
US7736452
US20050006526
Attorney, Agent or Firm:
Masatoshi Kurata
Nobuhisa Nogawa
Tadashi Inoue
Shigeru Iino
Ikuji Otaku
Naoki Kono
Sanae Kaneko