Title:
METHODS AND DEVICES FOR MACHINING QUENCHED WORKPIECE
Document Type and Number:
Japanese Patent JP2020163560
Kind Code:
A
Abstract:
To provide machining apparatus, systems and methods that enable a film adhesive and a quenched workpiece to be cut or otherwise machined together (e.g., simultaneously), thus reducing manufacturing costs and time.SOLUTION: A machining apparatus for machining a quenched workpiece includes a support surface that supports the quenched workpiece during machining by a machining tool of the machining apparatus, and further includes a cooling system operatively coupled to the support surface. The cooling system prevents a machining temperature of an adhesive coupled to the quenched workpiece from rising beyond a predetermined threshold temperature during machining of the quenched workpiece, and prevents curing of the adhesive. The cooling system includes a cooling fluid that radiantly cools the quenched workpiece via the support surface while the quenched workpiece is supported by the support surface, and maintains the machining temperature of the adhesive (and of the quenched workpiece) below ambient temperature. Related methods include machining the quenched workpiece using such a machining apparatus.SELECTED DRAWING: None
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Inventors:
CLIFFORD D BOROWICZ
Application Number:
JP2020030052A
Publication Date:
October 08, 2020
Filing Date:
February 26, 2020
Export Citation:
Assignee:
BOEING CO
International Classes:
B23Q3/08; B23Q11/12; B23Q15/18; B23Q17/00
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation