Title:
電子構成要素を有するアンテナ構造を装着するための方法および装置
Document Type and Number:
Japanese Patent JP7053837
Kind Code:
B2
Abstract:
A method and an apparatus are provided for the equipping of an antenna structure, in particular an RFID antenna structure, with an electronic component, in particular with an RFID chip. The method includes: (a) applying an electronic component to an antenna structure which is formed on a carrier substrate and which is made from a sinterable material that is electrically conductive after its sintering, so that a contact surface is formed between a contact region of the antenna structure and a corresponding electrical contact of the component; and (b) heating the antenna structure in order to sinter the same, thereby causing formation of an adhesive-free mechanical and electrical connection between the contact region of the antenna structure and the electrical contact of the component. The method can also be used to equip the antenna structure with a plurality of electronic components.
Inventors:
Siegmund Niclas
Application Number:
JP2020533070A
Publication Date:
April 12, 2022
Filing Date:
December 11, 2018
Export Citation:
Assignee:
Mulebauer Gaem Beher und Co Carge
International Classes:
G06K19/077; H01P11/00
Domestic Patent References:
| JP2004527814A | ||||
| JP2013109715A | ||||
| JP2015520800A | ||||
| JP2005309960A | ||||
| JP2008010841A | ||||
| JP2006053785A | ||||
| JP2007065867A | ||||
| JP2007156632A |
Foreign References:
| WO2014006787A1 |
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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