Title:
電子レンズにおいて基板のエッジの影響を低減するための方法と装置
Document Type and Number:
Japanese Patent JP4554223
Kind Code:
B2
Abstract:
One embodiment disclosed pertains to a method for inspecting a substrate. The method includes inserting the substrate into a holding place of a substrate holder, moving the substrate holder under an electron beam, and applying a voltage to a conductive element of the substrate holder. The voltage applied to the conductive element reduces a substrate edge effect. Another embodiment disclosed relates to an apparatus for holding a substrate that reduces a substrate edge effect. The apparatus includes a holding place for insertion of the substrate and a conductive element. The conductive element is positioned so as to be located within a gap between an edge of the holding place and an edge of the substrate.
Inventors:
Marian Mancos
David El Adler
David El Adler
Application Number:
JP2004015147A
Publication Date:
September 29, 2010
Filing Date:
January 23, 2004
Export Citation:
Assignee:
KL-Tenko Technologies, Corporation
International Classes:
H01J37/20; H01L21/66; G01N23/203; G01Q30/02; G01Q30/20; G21K7/00; H01J37/244; H01J37/28
Domestic Patent References:
| JP2000149845A |
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Kiyoharu Nishiyama
Takahiko Mizobe
Kiyoharu Nishiyama