Title:
基材をコーティングするための方法および装置
Document Type and Number:
Japanese Patent JP5882920
Kind Code:
B2
Abstract:
Methods and apparatus for coating substrates. A die can be employed for extrusion coating an elongated substrate, where the die defines a coating cavity therein. The die can comprise a die block having a coating supply channel for supplying a coating material to the coating cavity. The die can further comprise a guide plug and a die plate removably coupled to the die block. The guide plug can comprise a substrate inlet having a non-circular lateral cross-section, and the die plate can comprise a substrate outlet also having a non-circular lateral cross-section. A coating system comprising such a die can operate to coat a substrate where the substrate can be pushed at least partially through the die and contacts the coating material therein.
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Inventors:
Sabramanian Aswaran Ayer
Jeremy Richard Risotto
William Joseph Burgess
Wayne Scott Strasser
James Wilson Mercer
Tony Wayne Helton
Gary Darrell Boone
Jeremy Richard Risotto
William Joseph Burgess
Wayne Scott Strasser
James Wilson Mercer
Tony Wayne Helton
Gary Darrell Boone
Application Number:
JP2012557086A
Publication Date:
March 09, 2016
Filing Date:
March 03, 2011
Export Citation:
Assignee:
EASTMAN CHEMICAL COMPANY
International Classes:
B29C48/155; B05C5/02; B29C48/12; B29C48/154; B29C48/22; B29C48/30; B29C48/07; B29C48/08; B29C48/285
Domestic Patent References:
| JP2001009889A | ||||
| JP58118231A | ||||
| JP60085921A |
Foreign References:
| US5897708 | ||||
| US20040109946 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Naori Kota
Toko Saito
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Naori Kota
Toko Saito