レーザを用いて波長より小さなピッチで穴を開けるための方法および装置

Title:

レーザを用いて波長より小さなピッチで穴を開けるための方法および装置

Document Type and Number:

Japanese Patent JP4774146

Kind Code:

B2

Abstract:

A method of laser machining using an ultra-fast pulse laser is presented. According to the present invention a plurality of holes with a pitch less than the wavelength of the laser are drilled into a material sample. Reliable and reproducible hole drilling is accomplished through an exemplary drilling sequence which applies a number of pulses at a first pulse energy to the surface spaced to avoid laser hardening of the surface for adjacent holes of a first set of holes. Next, the number of pulses is increased or the energy of the laser beam is increased to drill holes that are interstitial to the first set of holes. The exemplary laser machining process may used to produce both one-dimensional and two-dimensional photonic crystals, among other applications.

Inventors:

Shinbin Ryu
Minri

Application Number:

JP2000391084A

Publication Date:

September 14, 2011

Filing Date:

December 22, 2000

Export Citation:

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