Title:
Methods and equipment for measuring relative critical dimensions
Document Type and Number:
Japanese Patent JP6305423
Kind Code:
B2
Abstract:
One embodiment relates to a method of measuring a relative critical dimension (RCD) during electron beam inspection of a target substrate. A reference image is obtained. A region of interest is defined in the reference image. A target image is obtained using an electron beam imaging apparatus. The target and reference images are aligned, and the region of interest is located in the target image. Measurement is then made of the RCD within the region of interest in the target image. Another embodiment relates to a method of measuring a RCD which involves scanning along a scan length that is perpendicular to the RCD. Point RCDs along the scan length are measured. A filter is applied to the point RCDs, and an average of the point RCDs is computed. Other embodiments, aspects and features are also disclosed.
Inventors:
Xiao Hong
Application Number:
JP2015545153A
Publication Date:
April 04, 2018
Filing Date:
November 25, 2013
Export Citation:
Assignee:
KLA-Tenker Corporation
International Classes:
G01B15/04; G03F1/86; H01J37/22
Domestic Patent References:
| JP20092785A | ||||
| JP5250515A | ||||
| JP2011116129A | ||||
| JP2011101254A | ||||
| JP200937939A |
Foreign References:
| US20120105617 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office
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