Title:
基板を精密加工するための方法および装置ならびにその使用
Document Type and Number:
Japanese Patent JP2009524523
Kind Code:
A
Abstract:
Method for structuring a surface layer (9) on a substrate (8) comprises guiding a liquid jet (6) directed onto the surface layer over the regions of the layer to be removed. The liquid jet contains an etching liquid having a strongly etching action than the material of the surface layer. The surface layer is locally heated in the regions to be removed. An independent claim is also included for a device for carrying out the above process.
Inventors:
Cry, daniel
Mette, Ansgarh
Bilo, Daniel
Mayor, Kuno
Hopman, Gibile
Label, stefan
Mette, Ansgarh
Bilo, Daniel
Mayor, Kuno
Hopman, Gibile
Label, stefan
Application Number:
JP2008551723A
Publication Date:
July 02, 2009
Filing Date:
January 25, 2007
Export Citation:
Assignee:
Fraonhofer-Gesellschaft Tour Felderung der Angewanten Forschung A Fao
Albert-Ludwig-Universityt Freiburg
Albert-Ludwig-Universityt Freiburg
International Classes:
B23K26/00; B23K26/14; B23K26/073; H01L31/04; B23K101/40
Foreign References:
| US6777647B1 | 2004-08-17 |
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Takako Koiso
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Takako Koiso