Title:
基材ウェブ上のパターンを製造する方法及び装置
Document Type and Number:
Japanese Patent JP6522591
Kind Code:
B2
Abstract:
A method of manufacturing a pattern on a substrate web includes providing a production tool having a surface relief structure of elevations and depressions. The elevations correspond to a desired pattern. A curable material is applied to the elevations. The material is brought into contact with a substrate web at a first location. The substrate web and surface relief structure are transported together in contact from the first location to a second location spaced from one another along the transport direction of the substrate web. The substrate web is separated from the surface relief structure at the second location whereupon the material forming the pattern is affixed to and carried by the substrate web. The material is cured by exposure to a curing energy source, either between the first and second locations and/or after the substrate web has been separated from the surface relief structure at the second location.
Inventors:
Brian william homes
Application Number:
JP2016517304A
Publication Date:
May 29, 2019
Filing Date:
September 26, 2014
Export Citation:
Assignee:
De La Ryu International Limited
International Classes:
B41M1/30; B41F35/02; B41M1/04; B41M1/10; B41M3/14; B42D25/23; B42D25/24; B42D25/29; B42D25/378; B42D25/40
Domestic Patent References:
| JP1307789A | ||||
| JP2010210767A | ||||
| JP2000511835A | ||||
| JP2001162774A | ||||
| JP2004123802A | ||||
| JP2005153445A | ||||
| JP2014527472A |
Foreign References:
| US6440277 | ||||
| US20060275625 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Naori Kota
Toko Saito
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Naori Kota
Toko Saito